By Suny Li (Li Yang)
ISBN-10: 1119045932
ISBN-13: 9781119045939
An complex reference documenting, intimately, each step of a true System-in-Package (SiP) layout flow
Written by way of an engineer on the innovative of SiP layout and implementation, this publication demonstrates the right way to layout SiPs utilizing Mentor EE stream. Key issues lined comprise cord bonding, die stacks, hollow space, turn chip and RDL (redistribution layer), Embedded Passive, RF layout, concurrent layout, Xtreme layout, 3D real-time DRC (design rule checking), and SiP manufacture.
Extensively illustrated all through, System in package deal layout and Simulation covers an array of problems with very important challenge for SiP layout and fabrication electronics engineers, in addition to SiP clients, together with:
- Cavity and sacked dies design
- FlipChip and RDL design
- Routing and coppering
- 3D Real-Time DRC check
- SiP simulation technology
- Mentor SiP layout and Simulation Platform
Designed to operate both good as a reference, educational, and self-study, System in package deal layout and Simulation is an critical operating source for each SiP fashion designer, particularly those that use Mentor layout tools.
Read Online or Download SiP System-in-Package Design and Simulation: Mentor EE Flow Advanced Design Guide PDF
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SiP System-in-Package Design and Simulation: Mentor EE Flow Advanced Design Guide by Suny Li (Li Yang)
by Michael
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